Reference:Release Notes Hardware IP112

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These release notes describe the IP112 Hardware Builds starting with build 501

This article is generated automatically. Do not edit! Please see the disclaimer before using the information presented here!


Contents

Hardware IP112

IP112 HW1000

Usage of ip112-pcb-800: Buckconverter changed to LM5161PWP

33398 - ip11x-pcb layout change for LM5161PWP

Buckconverter AX3162 changed to LM5161PWP

--> ip112-pcb-800

IP112 HW500

Main PCB HW200 IMX6 PCB HW500

71693 - Start

IP112 HW501

Main PCB HW200 IMX6 PCB HW501

8334 - imx6l-modul build 500

first 500 pcs reworked R570=10k instead of 220k

8381 - Power sequence changed for better production yield

IP112 HW600

Main PCB HW300 DFM update IMX6 PCB HW501

8380 - Clearance for USB riser board increased.

IP112 HW601

8614 - new display glass

Glass change in Display module FS-TST350MTQV-01B

IP112 HW700

Improved reliability of internal power supply.

8370 - IP112 PCB HW400 Larger copper area for U601

Improved heatflow

8366 - IP112 PCB HW400 TR301 pad size

Increased pad size for better soldering

IP112 HW701

18069 - hook switch spring with lower force

Drawing for IN-MECH-SPRING1-IP111 updated.

IP112 HW702

18403 - change of IN-FUSE-1210-POLYSWITCH-1A

from 500mA type to 750mA type

IP112 HW800

8362 - IMX6L-MODUL HW600

Manufacturing programming with the Micron SPI flash sometimes doesnt work because the CS line is initially floating. With IMX66L-Modul HW600 pullup R231 keeps CS inactive.

IP112 HW801

18069 - hook switch spring with lower force

Drawing for IN-MECH-SPRING1-IP111 updated.

IP112 HW802

18403 - change of IN-FUSE-1210-POLYSWITCH-1A

from 500mA type to 750mA type

IP112 HW803

21603 - L504 = 0Ohm to stabilize USB against ESD

IP112 HW804

updated hook switch pedal IN-MECH-PEDAL-IP111

18297 - changed switch point of hook switch pedal

dimensional change of IN-MECH-PEDAL-IP111

IP112 HW805

CMI display

30589 - Display change from TSLCD to CMI

33397 - glue 3103UV to fix speaker

56396 - U601 new stencil

Ab 00-90-33-4c-67-29

IP112 HW806

39147 - update of IN-MECH-LCD-FR-IP111

New construction of IN-MECH-LCD-FR-IP111 to ease the assembly of the CMI display. Ab 00-90-33-4c-6d-69

IP112 HW900

--> No further mass production scheduled.

22672 - IP112 PCB 600 - 4 layer PCB

4 layer PCB for better noise immunity 500pcs in production

--> No further mass production scheduled.

IP112A HW1000

initial small series start mac 009033514a7f

71694 - Start IP11xA

IP112A HW1100

Facelift

58899 - IP111A/IP112A: C612 changed from 0402 to 0603 package

58898 - IP111A/IP112A: Move S401 4mm right

IP112A HW1200

65655 - DFM Update

IMX6UL-MODUL: Solder mask at gold connector removed IMX6UL-MODUL: Layer stackup definition updated IMX6UL-MODUL: Chamfer definition updated

IP111 RGMII_CLK: GND shield improved IP111 Vias at SMD moved: C1 C311 C340 R603 Q602 Pin52 mpcie

IP112 RGMII_CLK: GND shield improved IP112 Vias at SMD moved: R403 Q602 Pin48 mpcie

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