Reference:Release Notes Hardware IP29-2/IP29-4/IP29-8
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These release notes describe the IP29(-x) Hardware Builds starting with build 200 (except IP29-20)
Please see the disclaimer before using the information presented here!
Hardware IP29/IP29-2/IP29-4
IP29 HW200
8376 - additional cooling parts
additional cooling plate for SLIC cooling
additional gap filler for MP8004
IP29 HW300
8351 - improved MP8004 heat flow
IP29 HW400
IP29 HW401
15477 - temporary usage of AC5014 instead of AC5012
IP29 HW600
IP29-2 HW400
IP29-2 HW600
IP29-2 HW800
IP29-4 HW400
8377 - efficieny improvement
PCB layout prepared to improve SLIC power supply efficiency
IP29-4 HW600
31298 - correct AC_DDR_CLK routing, shorten PCB below LEDs by 0.3mm
HWID 500 skipped
IP29-4 HW800
IP29-8 HW610
22061 - Winbond SPI Flash change from revision J to F
Needs also new bootcode for new device ID