ReleaseNotes:Hardware IP112
These release notes describe the IP112 Hardware Builds starting with build 501
Please see the disclaimer before using the information presented here!
Hardware IP112
IP112 HW1000
33398 - ip11x-pcb layout change for LM5161PWP
Buckconverter AX3162 changed to LM5161PWP
--> ip112-pcb-800
IP112 HW500
71693 - Start
IP112 HW501
8334 - imx6l-modul build 500
first 500 pcs reworked R570=10k instead of 220k
8381 - Power sequence changed for better production yield
IP112 HW600
8380 - Clearance for USB riser board increased.
IP112 HW601
8614 - new display glass
Glass change in Display module FS-TST350MTQV-01B
IP112 HW700
8370 - IP112 PCB HW400 Larger copper area for U601
Improved heatflow
8366 - IP112 PCB HW400 TR301 pad size
Increased pad size for better soldering
IP112 HW701
IP112 HW702
IP112 HW800
8362 - IMX6L-MODUL HW600
Manufacturing programming with the Micron SPI flash sometimes doesnt work because the CS line is initially floating. With IMX66L-Modul HW600 pullup R231 keeps CS inactive.
IP112 HW801
18069 - hook switch spring with lower force
Drawing for IN-MECH-SPRING1-IP111 updated.
IP112 HW802
18403 - change of IN-FUSE-1210-POLYSWITCH-1A
from 500mA type to 750mA type
IP112 HW803
21603 - L504 = 0Ohm to stabilize USB against ESD
IP112 HW804
18297 - changed switch point of hook switch pedal
dimensional change of IN-MECH-PEDAL-IP111
IP112 HW805
30589 - Display change from TSLCD to CMI
33397 - glue 3103UV to fix speaker
56396 - U601 new stencil
Ab 00-90-33-4c-67-29
IP112 HW806
39147 - update of IN-MECH-LCD-FR-IP111
New construction of IN-MECH-LCD-FR-IP111 to ease the assembly of the CMI display.
Ab 00-90-33-4c-6d-69
IP112 HW900
22672 - IP112 PCB 600 - 4 layer PCB
4 layer PCB for better noise immunity
500pcs in production
--> No further mass production scheduled.
29365 - New samsung DDR3 Die
K4B1G1646I-BYMA
K4B4G1646E-BYMA (1866MT)
K4B4G1646E-BYK0 (1600MT)
IP112A HW1000
71694 - Start IP11xA
IP112A HW1100
58899 - IP111A/IP112A: C612 changed from 0402 to 0603 package
58898 - IP111A/IP112A: Move S401 4mm right
IP112A HW1200
65655 - DFM Update
IMX6UL-MODUL: Solder mask at gold connector removed
IMX6UL-MODUL: Layer stackup definition updated
IMX6UL-MODUL: Chamfer definition updated
IP111 RGMII_CLK: GND shield improved
IP111 Vias at SMD moved:
C1
C311
C340
R603
Q602
Pin52 mpcie
IP112 RGMII_CLK: GND shield improved
IP112 Vias at SMD moved:
R403
Q602
Pin48 mpcie
IP112A HW1210
75889 - Change of display panel
(TN (LQ035NC111) --> IPS (LMMA05035EQN1))
IPS (LMMA05035EQN1))
IP112A HW1211
IP112A HW1220
IP112A HW1221
IP112A HW1300
74764 - ip112-pcb build 1300
see #73231 - DFM Update USB Buchse
IP112A HW1301
IP112A HW1302
111791 - ETH switch changed
Due to EOL of Realtek RTL8363NB-CG
--> RTL8363NB-VB-CG
current firmware version needed
IP112A HW1303
IP112A HW1304
159288 - CMI Display
LMMA05035EQN1 --> LQ035NC111
IP112A HW1310
IP112A HW1311
IP112A HW1312
IP112A HW1313
IP112A HW1314
IP112A HW1400
118851 - IP112-PCB HW1400
Supply chain update.
Replace components with long leadtime with alternatives that have a better availibility.
IP112A HW1410
IP112A HW1500
123829 - IP11xA layout update
Build 1500. Clearance between primary switch node and copper increased from 0.5mm to 1.0mm
IP112A HW1510
IP112A HW1600
126798 - DFM Update USB Connector
IP112A HW1601
143859 - IQS620A version 2
required firmware version 13r3sr5
IP112A HW1602
157752 - RT5752AHGJ6
IN-IC-BUCKCONVERTER-SOT23-2A -->
IN-IC-BUCKCONVERTER-RT5752-SOT23-6 |
IP112A HW1603
IP112A HW1604
177213 - IN-IND-10MM-68U-1.4A --> IN-IND-10MM-47U-1.75A
IP112A HW1610
IP112A HW1611
IP112A HW1612
169918 - Change of display panel
frida FRD350H54004-R