Reference:Release Notes Hardware IP111: Difference between revisions
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[[Category:Release Notes|Hardware]] | [[Category:Release Notes|Hardware]] |
Revision as of 17:50, 22 January 2021
These release notes describe the IP111 Hardware Builds starting at 500
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Hardware IP111
IP111 HW500
8382 - IP111: Diode in POE converter changed to 100V type for improved reliability
IP111 HW501
8336 - ip111-pcba build 500
D620 Suppressor Diode added
IP111 HW600
8334 - imx6l-modul build 500
first 500 pcs reworked R570=10k instead of 220k
8338 - imx6l-modul build 500
thicker raw PCB (560um between inner layers) to ensure better MPCIe connectivity
8586 - speaker change
MASTER 52FROOO-8S13A30H --> HUIZHOU YSDL52AF-08-5A29R
IP111 HW601
8585 - power sequencing changed
R510=10k R520=100k R550=100k R560=0R R570=10k; solves startup problem
IP111 HW602
8614 - new display glass
Glass change in Display module FS-TST350MTQV-01B
IP111 HW700
8362 - IMX6L-MODUL HW600
Manufacturing programming with the Micron SPI flash sometimes doesnt work because the CS line is initially floating. With IMX66L-Modul HW600 pullup R231 keeps CS inactive.
8563 - IP111 PCB HW600 Larger copper area for U601
Improved heatflow
118850 - IP111-PCB HW1400
Supply chain update.
Replace components with long leadtime with alternatives that have a better availibility.
IP111 HW701
18069 - hook switch spring with lower force
Drawing for IN-MECH-SPRING1-IP111 updated.
IP111 HW702
18297 - changed switch point of hook switch pedal
dimensional change of IN-MECH-PEDAL-IP111
IP111 HW703
30590 - Display change from TSLCD to CMI
IP111 HW704
39147 - update of IN-MECH-LCD-FR-IP111
New construction of IN-MECH-LCD-FR-IP111 to ease the assembly of the CMI display.
Ab 00-90-33-4c-6d-69
IP111 HW800
33398 - ip11x-pcb layout change for LM5161PWP
Buckconverter AX3162 changed to LM5161PWP
--> ip112-pcb-800
IP111A HW1000
71694 - Start IP11xA
IP111A HW1100
58899 - IP111A/IP112A: C612 changed from 0402 to 0603 package
58898 - IP111A/IP112A: Move S401 4mm right
IP111A HW1200
65655 - DFM Update
IMX6UL-MODUL: Solder mask at gold connector removed
IMX6UL-MODUL: Layer stackup definition updated
IMX6UL-MODUL: Chamfer definition updated
IP111 RGMII_CLK: GND shield improved
IP111 Vias at SMD moved:
C1
C311
C340
R603
Q602
Pin52 mpcie
IP112 RGMII_CLK: GND shield improved
IP112 Vias at SMD moved:
R403
Q602
Pin48 mpcie
IP111A HW1210
75889 - Change of display panel
(TN (LQ035NC111) --> IPS (LMMA05035EQN1))
IPS (LMMA05035EQN1))
IP111A HW1300
74763 - ip111-pcb build 1300
see #73230 - EMI Update
IP111A HW1301
IP111A HW1302
157752 - RT5752AHGJ6
IN-IC-BUCKCONVERTER-SOT23-2A -->
IN-IC-BUCKCONVERTER-RT5752-SOT23-6 |
IP111A HW1400
118851 - IP112-PCB HW1400
Supply chain update.
Replace components with long leadtime with alternatives that have a better availibility.
IP111A HW1500
123829 - IP11xA layout update
Build 1500. Clearance between primary switch node and copper increased from 0.5mm to 1.0mm
IP111A HW1501
143859 - IQS620A version 2
required firmware version 13r3sr5