Reference:Release Notes Hardware IP29-2/IP29-4/IP29-8: Difference between revisions
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(New page: This Roadmap describes IP29(-x) Hardware Builds starting with build 200<br/> <br/> This article is generated automatically. Do not edit! Please see ''[[Support:What is the DVL-Roadmap?|th...) |
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These release notes describe the IP29(-x) Hardware Builds starting with build 200 (except IP29-20)<br/> | |||
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Please see ''[[Reference:What_are_the_Release_Notes_Documents?|the disclaimer]]'' before using the information presented here! | |||
Please see ''[[ | |||
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[[Category:Release Notes|Hardware]] |
Latest revision as of 23:56, 22 January 2021
These release notes describe the IP29(-x) Hardware Builds starting with build 200 (except IP29-20)
Please see the disclaimer before using the information presented here!
Hardware IP29/IP29-2/IP29-4
IP29 HW200
8376 - additional cooling parts
additional cooling plate for SLIC cooling
additional gap filler for MP8004
IP29 HW300
8351 - improved MP8004 heat flow
IP29 HW400
IP29 HW401
15477 - temporary usage of AC5014 instead of AC5012
IP29 HW600
149873 - Maritime devices are labeled as IP29-8-maritime
MAC range for further 250 devices is:
009033442ef5 – 009033442fee
IP29-2 HW400
IP29-2 HW600
IP29-2 HW800
IP29-4 HW400
8377 - efficieny improvement
PCB layout prepared to improve SLIC power supply efficiency
IP29-4 HW600
31298 - correct AC_DDR_CLK routing, shorten PCB below LEDs by 0.3mm
HWID 500 skipped
IP29-4 HW800
IP29-8 HW610
22061 - Winbond SPI Flash change from revision J to F
Needs also new bootcode for new device ID