Reference:Release Notes Hardware IP112

From innovaphone wiki
Jump to navigation Jump to search

These release notes describe the IP112 Hardware Builds starting with build 501

Please see the disclaimer before using the information presented here!

Hardware IP112

IP112 HW1000

33398 - ip11x-pcb layout change for LM5161PWP

Buckconverter AX3162 changed to LM5161PWP

--> ip112-pcb-800

IP112 HW500

71693 - Start

IP112 HW501

8334 - imx6l-modul build 500

first 500 pcs reworked R570=10k instead of 220k

8381 - Power sequence changed for better production yield

IP112 HW600

8380 - Clearance for USB riser board increased.

IP112 HW601

8614 - new display glass

Glass change in Display module FS-TST350MTQV-01B

IP112 HW700

8370 - IP112 PCB HW400 Larger copper area for U601

Improved heatflow

8366 - IP112 PCB HW400 TR301 pad size

Increased pad size for better soldering

IP112 HW701

IP112 HW702

IP112 HW800

8362 - IMX6L-MODUL HW600

Manufacturing programming with the Micron SPI flash sometimes doesnt work because the CS line is initially floating. With IMX66L-Modul HW600 pullup R231 keeps CS inactive.

IP112 HW801

18069 - hook switch spring with lower force

Drawing for IN-MECH-SPRING1-IP111 updated.

IP112 HW802

18403 - change of IN-FUSE-1210-POLYSWITCH-1A

from 500mA type to 750mA type

IP112 HW803

21603 - L504 = 0Ohm to stabilize USB against ESD

IP112 HW804

18297 - changed switch point of hook switch pedal

dimensional change of IN-MECH-PEDAL-IP111

IP112 HW805

30589 - Display change from TSLCD to CMI

33397 - glue 3103UV to fix speaker

56396 - U601 new stencil

Ab 00-90-33-4c-67-29

IP112 HW806

39147 - update of IN-MECH-LCD-FR-IP111

New construction of IN-MECH-LCD-FR-IP111 to ease the assembly of the CMI display.
Ab 00-90-33-4c-6d-69

IP112 HW900

22672 - IP112 PCB 600 - 4 layer PCB

4 layer PCB for better noise immunity
500pcs in production

--> No further mass production scheduled.

29365 - New samsung DDR3 Die


K4B4G1646E-BYMA (1866MT)
K4B4G1646E-BYK0 (1600MT)

IP112A HW1000

71694 - Start IP11xA

IP112A HW1100

58899 - IP111A/IP112A: C612 changed from 0402 to 0603 package

58898 - IP111A/IP112A: Move S401 4mm right

IP112A HW1200

65655 - DFM Update

IMX6UL-MODUL: Solder mask at gold connector removed
IMX6UL-MODUL: Layer stackup definition updated
IMX6UL-MODUL: Chamfer definition updated

IP111 RGMII_CLK: GND shield improved
IP111 Vias at SMD moved:
Pin52 mpcie

IP112 RGMII_CLK: GND shield improved
IP112 Vias at SMD moved:
Pin48 mpcie

IP112A HW1210

75889 - Change of display panel

(TN (LQ035NC111) --> IPS (LMMA05035EQN1))

IPS (LMMA05035EQN1))

IP112A HW1211

IP112A HW1300

74764 - ip112-pcb build 1300

see #73231 - DFM Update USB Buchse

IP112A HW1301

IP112A HW1302

111791 - ETH switch changed

Due to EOL of Realtek RTL8363NB-CG

-->  RTL8363NB-VB-CG

current firmware version needed

IP112A HW1303

IP112A HW1304

159288 - CMI Display

LMMA05035EQN1 --> LQ035NC111

IP112A HW1400

118851 - IP112-PCB HW1400

Supply chain update.
Replace components with long leadtime with alternatives that have a better availibility.

IP112A HW1500

123829 - IP11xA layout update

Build 1500. Clearance between primary switch node and copper increased from 0.5mm to 1.0mm

IP112A HW1600

126798 - DFM Update USB Connector

IP112A HW1601

143859 - IQS620A version 2

required firmware version 13r3sr5

IP112A HW1602

157752 - RT5752AHGJ6